Bumblebee Stencils IC Chip BGA Reballing Stencil Solder Template for iPhone XS/XS Max /XR

• Imported alloy steel, high-temperature resistant and wear-resistant

• Designed specifically for mobile phone chips, it can make each solder ball round and full, meeting the needs of tin planting for various chips

• Easy and quickly for reballing the BGA IC

• Excellent to replace IC or BGA rework reballing

Compatible with:

• iPhone XS/XS Max /XR