Description
1. For Disassemble PCB Chips/Mobile Phone Frame
2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
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2. Heating plate with good and well-distributed heat conduction, will not be easy out of shape under high temperature
3. Thickened panel with pad
Our Delivery Process
![](https://cdn11.bigcommerce.com/s-yvpirc28f4/images/stencil/original/image-manager/lead-time-delivery-process.jpg)
Product Category:
Repair Tools/Repair Platform