RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA

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  • RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
  • RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
  • RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
  • RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
  • RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
Now: R348.00
Was: R541.00

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Description

RELIFE RL-044 0.12mm Thickness Motherboard Repair Stencils Planting Tin Network Mesh for iP7 to iP13 CPU/baseband/WI-FI/NFC/BGA
  • These stencils were made by high-quality eco-friendly material, anti-swell, heat-resistant and scratch-resistant, can be heated directly by a hot air gun
  • Super flexible and tough with good flatness, not easy to deform, with the normal bend it can be restored easily
  • Pioneer half engraving process, allow some components to be embedded on the groove in order to block the remaining tin and protect them from being burnt
  • Precise hole position of real machine measurements, with Cooling hole design, restore every soldering ball present on the initial drawing
  • The round-square hole makes the net more durable, it is easy and quickly for reballing and taking out, prevents the tin ball from getting stuck in the mesh

Note: The soldering process is complicated, so we highly recommend a professional to replace/solder, novices need the guidance of a professional.

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