Description
1. Special heating design and precise temperature control
2. Only heats the area that the CPU Motherboard board needs to be removed to prevent improper heating.
3. High purity copper is used as a film to ensure uniform heat transfer and heat.
4. Silicone insulation,high temperature resistance,lowering the temperature of the bottom contact surface.
5. Model:SS-T12A-Android
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2. Only heats the area that the CPU Motherboard board needs to be removed to prevent improper heating.
3. High purity copper is used as a film to ensure uniform heat transfer and heat.
4. Silicone insulation,high temperature resistance,lowering the temperature of the bottom contact surface.
5. Model:SS-T12A-Android
Our Delivery Process
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Product Category:
Repair Tools/Repair Platform